Position Sensor and Hybrid Substrate for Camera Focus Management

ABSTRACT

An apparatus includes a lens assembly that includes at least one lens that defines an optical axis, a lens holder coupled to the lens assembly, a substrate, an image sensor disposed on the substrate, and an actuator coupled between the lens holder and the substrate and configured to adjust a position of the substrate relative to the lens assembly to reposition the image sensor along the optical axis. The apparatus also includes a position sensor that includes a magnet and a magnetic field sensor. The position sensor is coupled to the substrate and the lens holder. The magnetic field sensor is configured to generate magnetic field data indicating a position of the substrate relative to the lens holder. The apparatus additionally includes circuitry configured to control the actuator based on the magnetic field data to place the image sensor within a depth of focus of the lens assembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 16/702,054, filed on Dec. 3, 2019, the entirecontent of which is hereby incorporated by reference as if fully setforth herein.

BACKGROUND

An optical system may include one or more lenses and an image sensor.The image sensor may include a plurality of light-sensing pixels thatmeasure an intensity of light incident thereon and thereby collectivelycapture an image of an environment. A Bayer filter may be applied to theimage sensor to allow the image sensor to generate color images of theenvironment. Optical systems may be used in a plurality of applicationssuch as photography, robotics, and autonomous vehicles.

SUMMARY

An optical system or apparatus includes an image sensor disposed on asubstrate, a lens, a lens holder coupled to the lens, an actuatorconnecting the lens holder to the substrate, and a position sensorcoupled to the substrate and the lens holder. The position sensor mayinclude a magnet and a magnetic field sensor. The apparatus alsoincludes circuitry configured to control the actuator based on data fromthe position sensor to maintain the image sensor within a depth of focusof the lens. In some implementations, the substrate may include aceramic printed circuit board (PCB), which may be electrically connectedto a laminate-based PCB by way of a flexible PCB connector. Thelaminate-based PCB may include thereon connectors exposed outside ahousing of the apparatus. The connectors may provide signals from theimage sensor to other components outside of the apparatus. Thelaminate-based PCB may accommodate repeated plugging-in and unpluggingfrom the connectors, while the ceramic PCB may, among other benefits,approximate the thermal expansion properties of the image sensor andprovide a thermal path between the image sensor and the housing.

In a first example embodiment, an apparatus is provided that includes alens assembly including at least one lens that defines an optical axis,a lens holder coupled to the lens assembly, a substrate, an image sensordisposed on the substrate, and an actuator coupled between the lensholder and the substrate and configured to adjust a position of thesubstrate relative to the lens assembly to reposition the image sensoralong the optical axis. The apparatus also includes a position sensorthat includes a magnet and a magnetic field sensor. The position sensoris coupled to the substrate and the lens holder. The magnetic fieldsensor is configured to generate magnetic field data indicating aposition of the substrate relative to the lens holder. The apparatusadditionally includes circuitry configured to control the actuator basedon the magnetic field data to place the image sensor within a depth offocus of the lens assembly.

In a second example embodiment, a method is provided that includesreceiving, from a position sensor that includes a magnet and a magneticfield sensor, magnetic field data indicative of a position of an imagesensor relative to a lens assembly. The lens assembly includes at leastone lens that defines an optical axis. The image sensor is disposed on asubstrate. The position sensor is coupled (i) to the substrate and (ii)to a lens holder coupled to the lens assembly. The method also includesdetermining, based on the magnetic field data, a control signal for anactuator coupled between the lens holder and the substrate andconfigured to adjust a position of the substrate relative to the lens toreposition the image sensor along the optical axis. The methodadditionally includes providing the control signal to the actuator toplace the image sensor within a depth of focus of the lens assembly.

In a third example embodiment, an apparatus is provided that includes alens assembly including at least one lens that defines an optical axis,a lens holder coupled to the lens assembly, a ceramic PCB including asurface that defines a plane, and an image sensor disposed on thesurface and electrically connected to the ceramic PCB. The apparatusalso include a laminate-based PCB coupled to the lens holder andincluding one or more electrical connectors, and a flexible PCBconnector electrically connecting the ceramic PCB to the laminate-basedPCB such that electrical signals from the image sensor are provided byway of the one or more electrical connectors. The apparatus alsoincludes an actuator coupled between the lens holder and the ceramic PCBand configured to adjust a position of the ceramic PCB relative to thelens assembly to reposition the image sensor along the optical axis, anda position sensor including a magnet coupled to the ceramic PCB and amagnetic field sensor connected to the laminate-based PCB. The magneticfield sensor is configured to generate magnetic field data indicating aposition of the image sensor relative to the lens assembly.

In a fourth example embodiment, a non-transitory computer readablestorage medium is provided having stored thereon instructions that, whenexecuted by a computing device, cause the computing device to performoperations. The operations include receiving, from a position sensorthat includes a magnet and a magnetic field sensor, magnetic field dataindicative of a position of an image sensor relative to a lens assembly.The lens assembly includes at least one lens that defines an opticalaxis. The image sensor is disposed on a substrate. The position sensoris coupled (i) to the substrate and (ii) to a lens holder coupled to thelens assembly. The operations also include determining, based on themagnetic field data, a control signal for an actuator coupled betweenthe lens holder and the substrate and configured to adjust a position ofthe substrate relative to the lens to reposition the image sensor alongthe optical axis. The operations additionally include providing thecontrol signal to the actuator to place the image sensor within a depthof focus of the lens assembly.

In a fifth example embodiment, a system is provided that includes meansfor receiving, from a position sensor that includes a magnet and amagnetic field sensor, magnetic field data indicative of a position ofan image sensor relative to a lens assembly. The lens assembly includesat least one lens that defines an optical axis. The image sensor isdisposed on a substrate. The position sensor is coupled (i) to thesubstrate and (ii) to a lens holder coupled to the lens assembly. Thesystem also includes means for determining, based on the magnetic fielddata, a control signal for an actuator coupled between the lens holderand the substrate and configured to adjust a position of the substraterelative to the lens to reposition the image sensor along the opticalaxis. The system additionally includes means for providing the controlsignal to the actuator to place the image sensor within a depth of focusof the lens assembly.

These, as well as other embodiments, aspects, advantages, andalternatives, will become apparent to those of ordinary skill in the artby reading the following detailed description, with reference whereappropriate to the accompanying drawings. Further, this summary andother descriptions and figures provided herein are intended toillustrate embodiments by way of example only and, as such, thatnumerous variations are possible. For instance, structural elements andprocess steps can be rearranged, combined, distributed, eliminated, orotherwise changed, while remaining within the scope of the embodimentsas claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an optical system, in accordance with exampleembodiments.

FIG. 2 illustrates an optical system, in accordance with exampleembodiments.

FIGS. 3A and 3B illustrate a position sensor in an optical system, inaccordance with example embodiments.

FIGS. 4A and 4B illustrate a position sensor in an optical system, inaccordance with example embodiments.

FIGS. 5A, 5B, 5C, 5D, and 5E illustrate a vehicle, in accordance withexample embodiments.

FIG. 6 illustrates a flow chart, in accordance with example embodiments.

DETAILED DESCRIPTION

Example methods, devices, and systems are described herein. It should beunderstood that the words “example” and “exemplary” are used herein tomean “serving as an example, instance, or illustration.” Any embodimentor feature described herein as being an “example,” “exemplary,” and/or“illustrative” is not necessarily to be construed as preferred oradvantageous over other embodiments or features unless stated as such.Thus, other embodiments can be utilized and other changes can be madewithout departing from the scope of the subject matter presented herein.

Accordingly, the example embodiments described herein are not meant tobe limiting. It will be readily understood that the aspects of thepresent disclosure, as generally described herein, and illustrated inthe figures, can be arranged, substituted, combined, separated, anddesigned in a wide variety of different configurations.

Further, unless context suggests otherwise, the features illustrated ineach of the figures may be used in combination with one another. Thus,the figures should be generally viewed as component aspects of one ormore overall embodiments, with the understanding that not allillustrated features are necessary for each embodiment.

Additionally, any enumeration of elements, blocks, or steps in thisspecification or the claims is for purposes of clarity. Thus, suchenumeration should not be interpreted to require or imply that theseelements, blocks, or steps adhere to a particular arrangement or arecarried out in a particular order. Unless otherwise noted, figures arenot drawn to scale.

I. Overview

A camera device may include an image sensor and one or more lenses thatform a lens assembly and are configured to focus light on the imagesensor. The image sensor may be disposed on a substrate, such as aprinted circuit board (PCB), which may be positioned relative to thelens assembly by way of a lens holder. In some implementations, therelative positioning of the image sensor and the lens may be fixed. Insuch an arrangement, however, it may be difficult to maintain the imagesensor within a depth of focus of the lens assembly as camera componentsexpand and contract due to changes in temperature. This may beespecially problematic in automotive applications where, in addition tothermal gradients inside the camera, ambient temperatures experienced bythe camera may fluctuate between, for example, −30 degrees Celsius and85 degrees Celsius.

Specifically, different portions of the camera may expand and contractto different extents due to temperature changes, causing the imagesensor to drift in and out of the depth of focus of the lens assembly,resulting in generation of out-of-focus images. The problem may beespecially apparent where the image sensor includes a small pixel size(resulting in a smaller image sensor) and/or the lens has a lowf-number, resulting in a small or shallow depth of focus (e.g.,approximately 10 microns). A low depth of focus may limit the maximumextent of warpage of the image sensor that can occur before thegenerated images are out of focus.

Warpage may be especially problematic when a coefficient of thermalexpansion (CTE) of the image sensor and/or its package is mismatched toa CTE of the substrate to which the image sensor is bonded. Such CTEmismatch may increase the extent to which the image sensor warps asambient temperature changes. Further, the CTE mismatch may also lead toincreased solder stress. For example, a ball grid array (BGA) connectingthe image sensor to the substrate may experience increased stress and ahigher rate of fatigue failures due to temperature cycling in the courseof camera operation. In some cases, passive athermalization accomplishedby matching the CTEs of different components may be helpful in reducingthe extent of these problems. Nevertheless, in some cases, matching theCTEs of components may be insufficient and/or difficult due tomanufacturing variations among the components.

Accordingly, an actuator may be connected between the substrate and thelens holder to allow for adjustments in the position of the image sensoralong the optical axis of the lens. In one implementation, the actuatormay be a linear actuator connecting the lens holder to the substrate.The actuator may shorten/contract to bring the image sensor closer tothe lens and lengthen/expand to move the image sensor away from thelens. Moving the image sensor, rather than the lens, may facilitatesealing of the camera components within a compact housing. Further,since the combined weight of the image sensor and the substrate may besmaller than that of the lens assembly, moving the image sensor andsubstrate may involve less force than moving the lens.

The actuator may be a piezoelectric actuator. For example, the actuatormay include a stack of two or more linear piezoelectric actuators and/ora piezoelectric tube actuator. In another implementation, the actuatormay be a bending actuator positioned along a plane defined by thesubstrate. The substrate may be fixedly connected to the lens holder atpoints along an outer periphery of the substrate. The bending actuatormay be configured to induce bending or bowing of the substrate in andout of the plane of the substrate. By inducing bending in a firstdirection, the image sensor may be brought closer to the lens and, byinducing bending in the other direction, the image sensor may be movedaway from the lens. The bending actuator may be implemented as apiezoelectric actuator, among other possibilities.

Piezoelectric actuators may provide high stiffness, resulting in aconnection that resists deflection under random vibrations (e.g., inautomotive applications). Piezoelectric actuators may also provide lowholding power, thus further accommodating the automotive setting whereadjustments in position are made and then maintained over the course ofminutes (e.g., to account for temperature changes from sunny to shadyenvironments), hours (e.g., to account for temperature changes fromnight to day operation), and/or months (e.g., to account for temperaturechanges from summer to winter environments). Further, in someimplementations, the CTE of the piezoelectric actuators may bewell-matched to the CTE of the substrate, such as when both of thesecomponents are made from ceramics, thereby providing additional passiveathermalization.

The camera may also include a housing connected to the lens holder andconfigured to house the substrate, the image sensor, the actuator, andthe PCB, among other components. Specifically, a chamber may be definedbetween the housing, the lens assembly, and the lens holder in whicheach of these components may be disposed. The plane defined by thesurface of the substrate may be disposed along a first wall of thehousing that is substantially perpendicular to the optical axis of thelens assembly. Thermal contact between the first wall and the substratemay allow heat from the image sensor to be dissipated through thehousing.

The camera may also include a position sensor connected to the lensholder and the substrate to provide position feedback that allows theimage sensor to be accurately positioned. In one implementation, theposition sensor may include a magnet and a magnetic field sensorconfigured to generate magnetic field data indicating a strength of amagnetic field generated by the magnet along a particular direction. Themagnet may be connected to the lens holder and the magnetic field sensormay be connected to the substrate, or vice versa, to measure therelative position of the lens relative to the image sensor. Notably,connecting the magnetic field sensor to the substrate (e.g., a PCB),rather than the lens holder, may facilitate the establishment ofelectrical connections for the sensor.

Control circuitry may be configured to receive the magnetic field data,determine a distance between the lens and the image sensor, and controlthe actuator to adjust the distance to a target distance (e.g., adistance that places the image sensor within the depth of focus of thelens). The position sensor may also allow the effects of any hysteresisor nonlinearities in the actuator to be accounted for when repositioningthe substrate.

The substrate may be electrically connected to a PCB (other than thesubstrate) by way of a flexible PCB connector. The PCB may be connectedto the lens holder and may include thereon one or more electricalconnectors that provide access to the electrical signals generated bythe image sensor. These electrical connectors may be exposed and/oraccessible outside of the housing. Thus, images from the image sensormay be shared with other components connected to the camera by way ofthe one or more electrical connectors.

The flexible PCB connector allows the substrate and the PCB to be placedat different positions and/or in different orientations within thehousing. For example, a plane defined by a surface of the PCB may bepositioned in an orientation substantially parallel to the optical axisof the lens, while the plane defined by the surface of the substrate maybe substantially perpendicular to the optical axis. The flexible PCBconnector may also provide a variable bend radius between the PCB andthe substrate. The variable bend radius may accommodate adjustments inthe position of the substrate relative to the lens holder. The flexiblePCB connector may thus allow for more control over the form factor ofthe camera and the locations within the housing at which the connectorsare exposed through the housing.

In one implementation, the image sensor may be bonded to a first side ofthe substrate and the flexible PCB connector may be bonded to a secondside of the substrate. A thermal interface material may be disposedbetween the flexible PCB connector and a portion of the housing todissipate heat from the image sensor to the housing by way of thesubstrate, the flexible PCB connector, and the thermal interfacematerial. In other implementations, the heat transfer from the imagesensor to the housing may be improved by forming the thermal connectionbetween the thermal interface material and the substrate directly,rather than by way of the flexible PCB connector. Accordingly, a portionof the flexible PCB connector that is bonded to the second side of thesubstrate may define an opening through which the thermal interfacematerial extends to make thermal contact with the substrate. Thisportion of the flexible PCB connector may be bonded, for example, near aperiphery of the substrate to define this opening.

In some implementations, the PCB may comprise a laminate-based PCB andthe substrate may comprise a ceramic PCB. The camera may beneficiallyutilize two different types of PCBs and the flexible PCB connector,rather than utilizing a single PCB, to accommodate different operatingconditions in different portions of the camera. For example, the PCBmaterials used around the integrated circuit package may be selected tomeet target thermal specifications, while the PCB materials used aroundthe external connectors may be selected to be robust to forcesexperienced during plugin of the connectors.

In particular, as the resolution, size, pixel density, and processingcapabilities of the image sensors used in cameras increase, the extentof heat generated by the image sensor may increase, making cooling ofthe image sensor chip a challenge. Operating the chip outside of atarget temperature range due to inadequate cooling may result indegraded image quality and reliability of the image sensor. Thus, theceramic PCB, rather than the laminate-based PCB, may be used as asubstrate for the image sensor to assist with transferring heat awayfrom the image sensor and out through the housing. In some examples, thethermal conductivity of the ceramic PCB may be 50 to 100 times higherthan the thermal conductivity of the laminate-based PCB. Further, theCTE of the ceramic PCB (e.g., 6-8 parts per million) may be bettermatched to the CTE of the image sensor than the CTE of thelaminate-based PCB (e.g., 14-16 parts per million). Thus, by bonding theimage sensor to the ceramic PCB, rather than the laminate-based PCB,warpage of the image sensor and solder stress may be reduced.

The ceramic PCB may, however, be more fracture-sensitive than thelaminate-based PCB. Thus, connectors that may experience varied loadsand stresses due to plugging into and unplugging from their matingconnectors may be placed on the laminate-based PCB. Specifically, thelaminate-based PCB may be more flexible and less brittle than theceramic PCB, and thus capable of withstanding such repeated plugin loadsand stresses.

The laminate-based PCB may have disposed thereon electrical componentsfor processing or conditioning the electrical signals of the imagesensor before these signals reach the electrical connectors and areexposed by way of the electrical connectors. By positioning theseelectrical components on the laminate-based PCB rather than the ceramicPCB, the thermal load around the integrated circuit package may bereduced. In some implementations, the ceramic PCB may also includethereon some electrical components. For example, components such asdecoupling capacitors whose effectiveness depends on proximity to theintegrated circuit package may be placed on the ceramic PCB. However, amajority of the electrical components may be placed on thelaminate-based PCB.

In some implementations, the position sensor may be connected to thelens holder by way of the laminate-based PCB, which may be fixedlyconnected to the lens holder. For example, the magnet may be connectedto the substrate and the magnetic field sensor may be connected to thelaminate-based PCB, or vice versa. Thus, the magnetic field sensor maybe disposed away from the high thermal load region around the sensor andin proximity to the circuitry configured to process the signal generatedby the magnetic field sensor.

II. Example Optical System

FIG. 1 illustrates an optical system 100. Optical system 100 may includelens assembly 110, lens holder 120, substrate 130, image sensor 140, PCB160, thermal sensor 170, position sensor 180, controller 186, andactuator(s) 194. In some embodiments, optical system 100 may includeand/or represent a camera system or a light detection and ranging(LIDAR) system. That is, optical system 100 could include and/orrepresent systems for capturing video and/or still images, and/or LIDARpoint cloud data.

Lens assembly 110 may include lens(es) 112. Lens(es) 112 may define anoptical axis 114, a focal distance 116, and a focal plane 118, amongother optical characteristics. Lens(es) 112 could include, for example,a spherical lens, an aspherical lens, a cylindrical lens, a Fresnellens, a gradient index lens, and/or a diffractive optical lens, amongother possibilities. Lens(es) 112 could be formed from plastic, glass,or another optical material. Lens holder 120 may be coupled to lensassembly 110 to position lens(es) 112 with respect to substrate 130and/or image sensor 140, among other components.

Substrate 130 may include a first surface and a second surface. In someembodiments, substrate 130 could include a printed circuit board (PCB),a semiconductor substrate, or another flexible or rigid body. Imagesensor 140 may be attached to the first surface of substrate 130. Thematerial of substrate 130 may be selected to (i) match a CTE of imagesensor 140 and (ii) provide high thermal conductivity to allow forefficient cooling of image sensor 140, among other considerations. Forexample, substrate 130 may include a ceramic PCB made out of alumina,aluminum nitride, beryllium oxide, or another ceramic material. In someimplementations, the ceramic PCB may be a co-fired ceramic, such as ahigh temperature co-fired ceramic (HTCC) or a low temperature co-firedceramic (LTCC). In one example, the ceramic PCB may be bonded to imagesensor 140 by way of a ball grid array.

PCB 160 may be mounted to lens holder 120. PCB 160 may includeelectrical connector(s) 162 and electrical component(s) 164. PCB 160 maybe electrically connected to substrate 130 by way of flexible PCBconnector(s) 150. PCB 160 may include, for example, a laminate-based PCBconfigured to accommodate repeated plugging into and unplugging fromelectrical connector(s) 162. The laminate-based PCB may be formed fromlaminae bonded together with a polymer resin. For example, thelaminate-based PCB may be an FR-4 board (i.e., fiberglass layers bondedwith epoxy resin), a CEM-3 board, or another non-ceramic material havingsimilar physical properties.

Flexible PCB connector(s) 150 may provide a variable bend radius toaccommodate repositioning of lens holder 120, on which PCB 160 ismounted, relative to substrate 130. Flexible PCB connector(s) 150 may bemade out of polytetrafluoroethylene, polyimide, and/or polyether etherketone, among other similar materials.

Electrical connector(s) 162 may be exposed outside of a housing ofoptical system 100 and configured to provide at least a portion ofsignals generated by image sensor 140. Electrical component(s) 164 maybe configured to process signals generated by image sensor 140, magneticfield sensor(s) 184, and other components of optical system 100 (e.g.,before such signals are exposed outside of the housing by way ofelectrical connector(s) 162).

Actuator(s) 194 may include piezoelectric structure(s) 196 coupledbetween lens holder 120 and substrate 130. In some embodiments, at leasta portion of piezoelectric structure(s) 196 could be arranged coaxiallyabout the optical axis 114. Piezoelectric structure(s) 196 may be formedfrom a variety of piezoelectric materials, including, but not limitedto, lead zirconate titanate (e.g., PZT), lithium niobate, bariumtitanate, potassium niobate, sodium tungstate, sodium potassium niobate,bismuth ferrite, among other possibilities.

In some embodiments, piezoelectric structure(s) 196 could include apiezoelectric tube. For example, the piezoelectric tube could be apiezoelectric tube actuator, such as Thorlabs PT49LM or PI PT120-PT140Series piezo tubes. In some embodiments, the piezoelectric tube could beconfigured to provide a desired axial expansion/contraction value and/ora desired diameter expansion/contraction value based on a known orexpected thermally-induced expansion or contraction of variouscomponents of the optical system 100. The piezoelectric tube may becontrollable so as to adjust at least one of (i) a distance betweenlens(es) 112 and image sensor 140 or (ii) a tip or tilt of image sensor140 with respect to focal plane 118, among other aspects of thegeometric arrangement of elements in optical system 100.

In other embodiments, piezoelectric structure(s) 196 could additionallyor alternatively include a piezoelectric linear actuator. For example,the piezoelectric linear actuator may include a plurality ofpiezoelectric linear actuators stacked on top of one another. In someembodiments, the piezoelectric linear actuator could be configured toprovide a desired axial expansion/contraction value based on a known orexpected thermally-induced expansion or contraction of variouscomponents of optical system 100.

In some implementations, piezoelectric structure(s) 196 could form twoor more stacks or posts arranged at respective positions along thesubstrate 130. For example, piezoelectric linear actuators may form fourstacks, with a first stack positioned above image sensor 140, a secondstack positioned below image sensor 140, a third stack positioned to theright of image sensor 140, and a fourth stack positioned to the left ofimage sensor 140 (when viewed from a top view). In such a scenario, eachof the stacks could be configured to be separately controllable so as toadjust at least one of (i) a distance between lens(es) 112 and imagesensor 140 or (ii) a tip or tilt of image sensor 140 with respect tofocal plane 118, among other aspects of the geometric arrangement ofelements in the optical system 100.

Actuator(s) 194 may be configured to maintain image sensor 140 at focalplane 118 and/or within a depth of focus of lens assembly 110 over apredetermined temperature range (e.g., −30 to 85° C.).

In various embodiments, actuator(s) 194 may additionally include steppermotor 198. For example, actuator(s) 194 could include piezoelectricstructure(s) 196 and stepper motor 198, which could be configured toprovide micro and macro movements, respectively, in the axial direction.In other words, piezoelectric structure(s) 196 could be utilized toprovide fine axial position adjustments (e.g., less than ±100 microns)and stepper motor 198 could be configured to provide coarse axialposition adjustments (e.g., greater than ±100 microns).

In some embodiments, optical system 100 could additionally include athermal sensor 170. Thermal sensor 170 could be configured to provideinformation indicative of a current temperature of at least a portion ofoptical system 100. In such a scenario, at least one property ofactuator(s) 194 could be configured to be adjusted based on the currenttemperature. In some embodiments, thermal sensor 170 could include athermocouple, a thermometer, or another type of temperature-sensingdevice.

Additionally or alternatively, optical system 100 could include positionsensor 180. Position sensor 180 could be configured to provideinformation indicative of a relative position of image sensor 140 and/orsubstrate 130 with respect to lens assembly 110 and/or lens holder 120.In such scenarios, at least one property of actuator(s) 194 could beconfigured to be adjusted based on the relative position of image sensor140 and/or substrate 130 with respect to lens assembly 110 and/or lensholder 120.

In some embodiments, position sensor 180 may include magnet(s) 182 andmagnetic field sensor(s) 184. For example, magnet(s) 182 may be mountedon lens holder 120 and magnetic field sensor(s) 184 may be mounted onsubstrate 130, or vice versa. In another example, magnet(s) 182 may bemounted on substrate 130 and magnetic field sensor(s) 184 may be mountedon PCB 160, or vice versa. Additionally or alternatively, positionsensor 180 may include a capacitive displacement sensor, an ultrasonicsensor, an inductive sensor, an optical proximity sensor, alaser-doppler vibrometer, or a camera. Other types of position sensorsare possible and contemplated.

In some embodiments, optical system 100 could also include controller186. Controller 186 may include processor(s) 188 and memory 190.Additionally or alternatively, controller 186 may include at least oneof a field-programmable gate array (FPGA) or an application-specificintegrated circuit (ASIC). As an example, processor(s) 188 may include ageneral-purpose processor or a special-purpose processor (e.g., digitalsignal processors, etc.). Processor(s) 188 may be configured to executecomputer-readable program instructions that are stored in memory 190. Insome embodiments, processor(s) 188 may execute the program instructionsto provide at least some of the functionality and operations describedherein.

Memory 190 may include or take the form of one or more computer-readablestorage media that may be read or accessed by processor(s) 188. The oneor more computer-readable storage media can include volatile and/ornon-volatile storage components, such as optical, magnetic, organic, orother memory or disc storage, which may be integrated in whole or inpart with at least one of processor(s) 188. In some embodiments, memory190 may be implemented using a single physical device (e.g., oneoptical, magnetic, organic, or other memory or disc storage unit), whilein other embodiments, memory 190 may be implemented using two or morephysical devices.

In some embodiments, the operations executable by controller 186 mayinclude determining control signal 192 to compensate for a thermal focusshift between lens(es) 112 and image sensor 140. In such scenarios, theoperations may also include providing control signal 192 to actuator(s)194.

In embodiments involving thermal sensor 170, the operations couldadditionally or alternatively include receiving, from thermal sensor170, information indicative of a current temperature of at least aportion of optical system 100. In such scenarios, determining controlsignal 192 could be based, at least in part, on the current temperature.

In embodiments involving position sensor 180, the operations mayadditionally or alternatively include receiving, from position sensor180, information indicative of a relative position of image sensor 140with respect to lens assembly 110 and/or lens holder 120. In suchscenarios, determining control signal 192 could be based on the relativeposition of image sensor 140 with respect to lens assembly 110.

FIG. 2 illustrates optical system 200. Optical system 200 may includeelements that are similar or identical to those of optical system 100,as illustrated and described in relation to FIG. 1. For example, opticalsystem 200 may include substrate 130 having first surface 132 (e.g., topsurface) and second surface 134 (e.g., bottom surface). Image sensor 140may be mounted directly or indirectly (e.g., via a readout integratedcircuit (ROIC)) to first surface 132 of substrate 130. In someembodiments, optical element 210 (e.g., an infrared filter) could bedisposed along optical axis 114.

Optical system 200 may include actuator(s) 194 disposed between lensholder 120 and substrate 130. Lens holder 120 may be coupled to lensassembly 110, which may include one or more lens(es) 112, which maydefine optical axis 114, focal distance 116, and/or focal plane 118.Actuator(s) 194 may be configured to control a relative position ofimage sensor 140 with respect to lens assembly 110 and/or lens(es) 112.In some implementations, actuator(s) 194 may at least partially surroundimage sensor 140 and/or optical element 210, among other components. Forexample, the piezoelectric tube may continuously surround image sensor140 (i.e., image sensor 140 may be disposed in an interior volume of thepiezoelectric tube). In another example, stacks of the piezoelectriclinear actuators may be disposed around image sensor 140 in adiscontinuous fashion, such that space between these stacks may remainvacant.

Optical system 200 may include position sensor 180 and thermal sensor170. It will be understood that while FIG. 2 illustrates position sensor180 and thermal sensor 170 at particular locations with respect to otherelements of optical system 200, other locations of position sensor 180and thermal sensor 170 are possible and contemplated. Arrow 202 providesa reference point between the view of FIG. 2 and the views of FIGS. 3A,3B, 4A, and 4B.

FIG. 3A illustrates optical system 300. At least some elements ofoptical system 300 could be similar or identical to the elements ofoptical systems 100 or 200, as illustrated and described in relation toFIGS. 1 and 2. As illustrated in FIG. 3A, optical system 300 may includea “stackup” of substrate 130, actuator(s) 194, lens holder 120, and lensassembly 110. Alternative stackups are possible and contemplated. Imagesensor 140 may be mounted on substrate 130 by way of portion 308 (e.g.,a ceramic package portion) of an integrated circuit package in whichimage sensor 140 is contained.

Optical system 300 may also include PCB 160 connected to substrate 130by way of flexible PCB connector 150. Flexible PCB connector 150 may bebonded to substrate 130 by way of anisotropic conductive film (ACF) bond302, among other possibilities. PCB 160 may include thereon electricalcomponents 164 and electrical connector 162. By placing electricalcomponents 164 on PCB 160, rather than on substrate 130, the thermalload around image sensor 140 may be reduced, thus facilitating thermalmanagement of optical system 300.

Optical system 300 may additionally include magnetic field sensor 184and magnet 182. Magnet 182 may be mounted to lens holder 120 whilemagnetic field sensor 184 may be mounted on substrate 130, or viceversa. Mounting magnetic field sensor 184 on substrate 130 mayfacilitate routing of electrical signals from magnetic field sensor 184to electrical components 164, where these signals may be processed todetermine the distance between image sensor 140 and lens holder 120. Onthe other hand, when magnetic field sensor 184 is connected to lensholder 120, signals therefrom may be routed to PCB 160 by way ofadditional electrical connectors (e.g., wires) since lens holder 120 isnot necessarily in electrical contact with PCB 160.

Although only one pair of magnet 182 and magnetic field sensor 184 isshown in the cross-sectional view of FIG. 3A, multiple such pairs may bedisposed around image sensor 140. For example, four such pairs of magnet182 and magnetic field sensor 184 may be provided in a symmetricarrangement around image sensor 140, thus allowing for monitoring of thetip (e.g., rotation along y-axis) and tilt (e.g., rotation along x-axis)of image sensor 140 in addition to monitoring the position of imagesensor 140 along the z-axis.

Optical system 300 may further include housing 306, which may beconnected to lens holder 120 so as to define a chamber between housing306, lens assembly 110, and lens holder 120. The chamber may containtherein substrate 130, image sensor 140, actuator(s) 194, magnet 182,magnetic field sensor 184, and PCB 160, among other components. Housing306 may shield and protect these components from the outsideenvironment. Housing 306 may define therein an opening through whichelectrical connector 162 may protrude so as to be accessible outsidehousing 306, thus allowing optical system 300 to communicate with othercomponents or systems.

In some implementations, thermal interface material (TIM) 304 may bedisposed between housing 306 and flexible PCB connector 150. Thus, heatfrom image sensor 140 may be dissipated to housing 306 by way ofsubstrate 130, ACF bond 302, flexible PCB connector 150, and TIM 304.Alternatively, TIM 304 may be in direct contact with substrate 130. Forexample, flexible PCB connector 150 and ACF bond 302 may be arrangedalong a periphery of substrate 130 to define an opening through whichTIM 304 may directly contact substrate 130. This opening may beapproximately circular or rectangular, among other possibilities, andmay depend on the arrangement of electrical contact pads on the bottomside of substrate 130.

FIG. 3B illustrates a close-up view of a portion of optical system 300.Specifically, FIG. 3B illustrates magnetic field lines to indicate amagnetic field generated by magnet 182 that may be detected by magneticfield sensor 184. Magnetic field sensor 184 may be configured to measurea magnitude of the magnetic field along the z-direction. Thus, as lensholder 120 and magnet 182 move away from substrate 130 and magneticfield sensor 184, the measured magnitude of the magnetic field maydecrease according to a predetermined relationship. Similarly, as lensholder 120 and magnet 182 move toward substrate 130 and magnetic fieldsensor 184, the measured magnitude of the magnetic field may increaseaccording to the predetermined relationship. Thus, the relative positionof lens holder 120 and substrate 130 may be determined based on themeasured magnitude of the magnetic field using this predeterminedrelationship.

FIG. 4A illustrates optical system 400. Some elements of optical system400 may be similar or identical to elements of optical systems 100, 200,or 300, as illustrated and described in relation to FIGS. 1, 2, 3A, and3B. Optical system 400 includes magnet 182 and magnetic field sensor 184disposed in an alternative arrangement from that of FIGS. 3A and 3B.Specifically, magnet 182 may be connected to substrate 130 whilemagnetic field sensor 184 may be connected to PCB 160. In someimplementations, magnet 182 may instead be connected to PCB 160 andmagnetic field sensor 184 may be connected to substrate 130.

Both of these arrangements of magnet 182 and magnetic field sensor 184may facilitate routing of signals from magnetic field sensor 184 toelectrical components 164 because both substrate 130 and PCB 160 areelectrically connected to electrical components 164. In the arrangementshown in FIG. 4A, magnetic field sensor 184 may be configured to measurethe magnitude of the magnetic field generated by magnet 182 along the zdirection and/or along the x direction.

As illustrated in FIG. 4A, A first portion of PCB 160 may be connectedto lens holder 120 such that a plane defined by a surface of PCB 160 issubstantially parallel to optical axis 114 (e.g., within 10 degrees ofparallel). A second portion of PCB 160 might not be connected to lensholder 120, and may instead protrude away therefrom in the direction ofsubstrate 130. Magnetic field sensor 184 may be connected to this secondportion of PCB 160 so as to be positioned near magnet 182 and thus ableto measure the magnetic field generated thereby. Additionally, a surfaceof substrate 130 may also define a plane that is substantiallyperpendicular to optical axis 114 (e.g., within 10 degrees ofperpendicular). Thus, PCB 160 may be oriented substantiallyperpendicularly to substrate 130.

FIG. 4B illustrates optical system 410. Some elements of optical system410 may be similar or identical to elements of optical systems 100, 200,300, or 400, as illustrated and described in relation to FIGS. 1, 2, 3A,3B, and 4A. Optical system 410 additionally includes spring 344 disposedbetween housing 306 and substrate 130 to bias substrate 130 towards lensholder 120. Biasing substrate 130 towards lens holder 120 may operate topreload piezoelectric structures 196. Housing 306 may includeprotrusions 346A and 346B that define a relief or space in which spring344 is retained to reduce or prevent drifting. Spring 344 may alsoprovide a thermal path by way of which heat generated by image sensor140 may be dissipated to the outside environment. TIM may be providedbetween spring 344 and housing 306, as well as between spring 344 andsubstrate 130, to further facilitate heat transfer.

III. Example Vehicles

FIGS. 5A, 5B, 5C, 5D, and 5E illustrate a vehicle 500, according to anexample embodiment. In some embodiments, the vehicle 500 could be asemi-autonomous or a fully-autonomous vehicle. While FIGS. 5A, 5B, 5C,5D, and 5E illustrates vehicle 500 as being an automobile (e.g., apassenger van), it will be understood that vehicle 500 could includeanother type of autonomous vehicle, robot, or drone that can navigatewithin its environment using sensors and other information about itsenvironment.

The vehicle 500 may include one or more sensor systems 502, 504, 506,508, and 510. In some embodiments, sensor systems 502, 504, 506, 508,and 510 could include optical systems 100, 200, 300, 400 and/or 410 asillustrated and described in relation to FIGS. 1, 2, 3A, 3B, 4A, and 4B.In other words, the optical systems described elsewhere herein could becoupled to the vehicle 500 and/or could be utilized in conjunction withvarious operations of the vehicle 500. As an example, the opticalsystems 100, 200, 300, 400 and/or 410 could be utilized in self-drivingor other types of navigation, planning, perception, and/or mappingoperations of the vehicle 500.

While the one or more sensor systems 502, 504, 506, 508, and 510 areillustrated on certain locations on vehicle 500, it will be understoodthat more or fewer sensor systems could be utilized with vehicle 500.Furthermore, the locations of such sensor systems could be adjusted,modified, or otherwise changed as compared to the locations of thesensor systems illustrated in FIGS. 5A, 5B, 5C, 5D, and 5E.

In some embodiments, the one or more sensor systems 502, 504, 506, 508,and 510 could include image sensors. Additionally or alternatively theone or more sensor systems 502, 504, 506, 508, and 510 could includeLIDAR sensors. For example, the LIDAR sensors could include a pluralityof light-emitter devices arranged over a range of angles with respect toa given plane (e.g., the x-y plane). For example, one or more of thesensor systems 502, 504, 506, 508, and 510 may be configured to rotateabout an axis (e.g., the z-axis) perpendicular to the given plane so asto illuminate an environment around the vehicle 500 with light pulses.Based on detecting various aspects of reflected light pulses (e.g., theelapsed time of flight, polarization, intensity, etc.), informationabout the environment may be determined.

In an example embodiment, sensor systems 502, 504, 506, 508, and 510 maybe configured to provide respective point cloud information that mayrelate to physical objects within the environment of the vehicle 500.While vehicle 500 and sensor systems 502, 504, 506, 508, and 510 areillustrated as including certain features, it will be understood thatother types of sensor systems are contemplated within the scope of thepresent disclosure.

While LIDAR systems with single light-emitter devices are described andillustrated herein, LIDAR systems with multiple light-emitter devices(e.g., a light-emitter device with multiple laser bars on a single laserdie) are also contemplated. For example, light pulses emitted by one ormore laser diodes may be controllably directed about an environment ofthe system. The angle of emission of the light pulses may be adjusted bya scanning device such as, for instance, a mechanical scanning mirrorand/or a rotational motor. For example, the scanning devices couldrotate in a reciprocating motion about a given axis and/or rotate abouta vertical axis. In another embodiment, the light-emitter device mayemit light pulses towards a spinning prism mirror, which may cause thelight pulses to be emitted into the environment based on an angle of theprism mirror angle when interacting with each light pulse. Additionallyor alternatively, scanning optics and/or other types ofelectro-opto-mechanical devices are possible to scan the light pulsesabout the environment.

While FIGS. 5A-5E illustrate various sensors attached to the vehicle500, it will be understood that the vehicle 500 could incorporate othertypes of sensors.

It will be understood that optical systems 100, 200, 300, 400, and 410could be implemented with the LIDAR sensors and/or camera image sensorsof vehicle 500 to compensate for thermal expansion effects that mayotherwise negatively affect optical system performance. For example, theactuator(s) 194 of such optical systems could be configured to adjust anaxial position of the respective image sensors 140 with respect to therespective lens assemblies 110 and/or respective lenses 112. It will beunderstood that the optical systems described herein could beincorporated in other ways with respect to the vehicle 500.

IV. Additional Example Operations

FIG. 6 illustrates a flow chart of operations related to controlling anoptical system. The operations may related to elements of and/or becarried out by optical systems 100, 200, 300, 400, and/or 410, amongother possibilities. However, the process can be carried out by othertypes of devices or device subsystems. For example, the process could becarried out by a portable computer, such as a laptop or a tablet device.The embodiments of FIG. 6 may be simplified by the removal of any one ormore of the features shown therein. Further, these embodiments may becombined with features, aspects, and/or implementations of any of theprevious figures or otherwise described herein.

Block 600 may involve receiving, from a position sensor including amagnet and a magnetic field sensor, magnetic field data indicative of aposition of an image sensor relative to a lens assembly. The lensassembly may include at least one lens that defines an optical axis. Theimage sensor may be disposed on a substrate. The position sensor may becoupled (i) to the substrate and (ii) to a lens holder coupled to thelens assembly.

Block 602 may involve determining, based on the magnetic field data, acontrol signal for an actuator. The actuator may be coupled between thelens holder and the substrate and configured to adjust a position of thesubstrate relative to the lens to reposition the image sensor along theoptical axis.

Block 604 may involve providing the control signal to the actuator toplace the image sensor within a depth of focus of the lens assembly.

In some embodiments, the magnet may be mounted on the substrate and themagnetic field sensor may be mounted on the lens holder.

In some embodiments, the magnet may be mounted on the lens holder andthe magnetic field sensor may be mounted on the substrate.

In some embodiments, a PCB may be connected to the lens holder. The PCBmay include one or more electrical connectors. A flexible PCB connectormay electrically connect the substrate to the PCB such that electricalsignals from the image sensor are provided by way of the one or moreelectrical connectors. The flexible PCB connector may provide a variablebend radius to accommodate adjustments in the position of the substraterelative to the lens holder.

In some embodiments, the magnet may be mounted on the substrate and themagnetic field sensor may be mounted on the PCB. Thus, the magneticfield sensor may be coupled to the lens holder by way of the PCB.

In some embodiments, the PCB may be coupled to the lens holder such thatthe PCB is substantially parallel to the optical axis and substantiallyperpendicular to a plane defined by a surface of the substrate. A firstportion of a first surface of the PCB may be disposed along the lensholder. The magnetic field sensor may be mounted on a second portion ofthe first surface of the PCB that protrudes away from the lens holderand towards the substrate.

In some embodiments, the magnet may be mounted on the PCB and themagnetic field sensor is mounted on the substrate. Thus, the magnet maybe coupled to the lens holder by way of the PCB.

In some embodiments, a housing may be coupled to the lens holder. Theimage sensor, the substrate, the PCB, the actuator, and the positionsensor may be disposed in a chamber defined between the lens holder, thelens assembly, and the housing. The one or more electrical connectorsmay be exposed outside the housing.

In some embodiments, the image sensor may be bonded to a first side ofthe substrate. The flexible PCB connector may be bonded to a second sideof the substrate. A thermal conductivity of the substrate may be higherthan (i) a thermal conductivity of the PCB and (ii) a thermalconductivity of the flexible PCB connector. A housing may be coupled tothe lens holder and a thermal interface material may be disposed betweenthe substrate and a portion of the housing to dissipate heat from theimage sensor to the housing by way of the substrate and the thermalinterface material. A portion of the flexible PCB connector that isbonded to the second side of the substrate may define an opening throughwhich the thermal interface material extends to make thermal contactwith the substrate.

In some embodiments, the PCB may include a laminate-based PCB having afirst CTE and the substrate may include a ceramic PCB having a secondCTE. The image sensor may have a third CTE. A difference between thesecond CTE and the third CTE may be smaller than a difference betweenthe first CTE and the third CTE.

In some embodiments, one or more electrical components may be disposedon the PCB and configured to process the electrical signals from theimage sensor before the electrical signals reach the one or moreelectrical connectors.

In some embodiments, the image sensor may be disposed between thesubstrate and the lens assembly.

In some embodiments, the substrate may be disposed between the imagesensor and the lens assembly. The substrate may define an opening thatprovides an optical path between the lens assembly and the image sensor.

In some embodiments, circuitry may be configured to control the actuatorbased on the magnetic field data. The circuitry may be configured todetermine, based on the magnetic field data, the position of thesubstrate relative to the lens holder and control the actuator based onthe position.

In some embodiments, the actuator may include a piezoelectric actuator.

In some embodiments, the actuator may be a linear actuator coupled tothe substrate and to the lens holder and configured to contract andexpand parallel to the optical axis to reposition the image sensor alongthe optical axis.

In some embodiments, the actuator may be a bending actuator coupled tothe substrate and configured to induce bowing in the substrate along theoptical axis to reposition the image sensor along the optical axis.

V. Conclusion

The present disclosure is not to be limited in terms of the particularembodiments described in this application, which are intended asillustrations of various aspects. Many modifications and variations canbe made without departing from its scope, as will be apparent to thoseskilled in the art. Functionally equivalent methods and apparatuseswithin the scope of the disclosure, in addition to those describedherein, will be apparent to those skilled in the art from the foregoingdescriptions. Such modifications and variations are intended to fallwithin the scope of the appended claims.

The above detailed description describes various features and operationsof the disclosed systems, devices, and methods with reference to theaccompanying figures. In the figures, similar symbols typically identifysimilar components, unless context dictates otherwise. The exampleembodiments described herein and in the figures are not meant to belimiting. Other embodiments can be utilized, and other changes can bemade, without departing from the scope of the subject matter presentedherein. It will be readily understood that the aspects of the presentdisclosure, as generally described herein, and illustrated in thefigures, can be arranged, substituted, combined, separated, and designedin a wide variety of different configurations.

With respect to any or all of the message flow diagrams, scenarios, andflow charts in the figures and as discussed herein, each step, block,and/or communication can represent a processing of information and/or atransmission of information in accordance with example embodiments.Alternative embodiments are included within the scope of these exampleembodiments. In these alternative embodiments, for example, operationsdescribed as steps, blocks, transmissions, communications, requests,responses, and/or messages can be executed out of order from that shownor discussed, including substantially concurrently or in reverse order,depending on the functionality involved. Further, more or fewer blocksand/or operations can be used with any of the message flow diagrams,scenarios, and flow charts discussed herein, and these message flowdiagrams, scenarios, and flow charts can be combined with one another,in part or in whole.

A step or block that represents a processing of information maycorrespond to circuitry that can be configured to perform the specificlogical functions of a herein-described method or technique.Alternatively or additionally, a block that represents a processing ofinformation may correspond to a module, a segment, or a portion ofprogram code (including related data). The program code may include oneor more instructions executable by a processor for implementing specificlogical operations or actions in the method or technique. The programcode and/or related data may be stored on any type of computer readablemedium such as a storage device including random access memory (RAM), adisk drive, a solid state drive, or another storage medium.

The computer readable medium may also include non-transitory computerreadable media such as computer readable media that store data for shortperiods of time like register memory, processor cache, and RAM. Thecomputer readable media may also include non-transitory computerreadable media that store program code and/or data for longer periods oftime. Thus, the computer readable media may include secondary orpersistent long term storage, like read only memory (ROM), optical ormagnetic disks, solid state drives, compact-disc read only memory(CD-ROM), for example. The computer readable media may also be any othervolatile or non-volatile storage systems. A computer readable medium maybe considered a computer readable storage medium, for example, or atangible storage device.

Moreover, a step or block that represents one or more informationtransmissions may correspond to information transmissions betweensoftware and/or hardware modules in the same physical device. However,other information transmissions may be between software modules and/orhardware modules in different physical devices.

The particular arrangements shown in the figures should not be viewed aslimiting. It should be understood that other embodiments can includemore or less of each element shown in a given figure. Further, some ofthe illustrated elements can be combined or omitted. Yet further, anexample embodiment can include elements that are not illustrated in thefigures.

While various aspects and embodiments have been disclosed herein, otheraspects and embodiments will be apparent to those skilled in the art.The various aspects and embodiments disclosed herein are for purpose ofillustration and are not intended to be limiting, with the true scopebeing indicated by the following claims.

What is claimed is:
 1. An apparatus comprising: a housing; a substratedisposed at a first position within the housing and including a surfacedefining a plane; an integrated circuit package disposed within thehousing and on the surface of the substrate, wherein the integratedcircuit package is electrically connected to the substrate; a printedcircuit board (PCB) disposed at a second position within the housing andcomprising one or more connectors accessible outside the housing; and aflexible PCB connector electrically connecting the substrate to the PCBsuch that electrical signals from the integrated circuit package areaccessible outside the housing by way of the one or more connectors. 2.The apparatus of claim 1, wherein the substrate comprises a firstmaterial and the PCB comprises a second material, and wherein the firstmaterial is different from the second material.
 3. The apparatus ofclaim 2, wherein the first material is a ceramic material, and whereinthe second material is a laminate-based material.
 4. The apparatus ofclaim 1, wherein the substrate has a first coefficient of thermalexpansion (CTE), wherein the PCB has a second CTE, wherein theintegrated circuit package has a third CTE, and wherein a differencebetween the first CTE and the third CTE is smaller than a differencebetween the second CTE and the third CTE.
 5. The apparatus of claim 1,wherein a thermal conductivity of the substrate is higher than a thermalconductivity of the PCB.
 6. The apparatus of claim 1, furthercomprising: a lens; and a lens holder configured to retain the lens at afixed position relative to the housing such that an optical axis definedby the lens is substantially perpendicular to the plane defined by thesurface of the substrate.
 7. The apparatus of claim 6, furthercomprising: an actuator coupled between the lens holder and thesubstrate and configured to adjust a position of the substrate relativeto the lens to reposition the integrated circuit package along anoptical axis of the lens, wherein the flexible PCB connector provides avariable bend radius to accommodate adjustments in the position of thesubstrate relative to the lens holder.
 8. The apparatus of claim 6,further comprising: a position sensor comprising at least twocomponents, wherein a first component of the at least two components ismounted on the substrate, and wherein the position sensor is configuredto generate data indicative of a position of the substrate relative tothe lens holder.
 9. The apparatus of claim 8, wherein a second componentof the at least two components is mounted on the PCB.
 10. The apparatusof claim 8, wherein a second component of the at least two components ismounted on the lens holder.
 11. The apparatus of claim 8, wherein the atleast two components comprise a magnet and a magnetic field sensor. 12.The apparatus of claim 6, wherein the integrated circuit package isdisposed in a first chamber defined between the substrate, the lensholder, and the lens, and wherein the substrate and the PCB are disposedin a second chamber defined between the housing and the lens holder. 13.The apparatus of claim 6, wherein: the integrated circuit package isdisposed between the substrate and the lens; or the substrate isdisposed between the integrated circuit package and the lens, and thesubstrate defines an opening that provides an optical path between thelens and the integrated circuit package.
 14. The apparatus of claim 6,wherein the substrate is disposed along a first wall of the housing thatis substantially parallel to the plane defined by the surface of thesubstrate, and wherein the PCB is disposed along a second wall of thelens holder that is substantially perpendicular to the plane defined bythe surface of the substrate.
 15. The apparatus of claim 1, furthercomprising: one or more electrical components disposed on the PCB andconfigured to process the electrical signals from the integrated circuitpackage before the electrical signals reach the one or more connectors.16. The apparatus of claim 1, wherein the apparatus further comprises: athermal interface material disposed between the substrate and a portionof the housing and configured to dissipate heat from the integratedcircuit package to the housing by way of the substrate and the thermalinterface material.
 17. The apparatus of claim 16, wherein theintegrated circuit package is bonded to a first side of the substrate,wherein the flexible PCB connector is bonded to a second side of thesubstrate, wherein a portion of the flexible PCB connector that isbonded to the second side of the substrate defines an opening throughwhich the thermal interface material extends to make thermal contactwith the substrate.
 18. The apparatus of claim 16, wherein theintegrated circuit package is bonded to a first side of the substrate,wherein the flexible PCB connector is bonded to a second side of thesubstrate, wherein the thermal interface material is disposed betweenthe flexible PCB connector and the portion of the housing such that heatis dissipated from the integrated circuit package to the housingadditionally by way of the flexible PCB connector.
 19. A systemcomprising: a vehicle; an optical device comprising: a housing; asubstrate disposed at a first position within the housing and includinga surface defining a plane; an integrated circuit package disposedwithin the housing and on the surface of the substrate, wherein theintegrated circuit package is electrically connected to the substrate; aprinted circuit board (PCB) disposed at a second position within thehousing and comprising one or more connectors accessible outside thehousing; and a flexible PCB connector electrically connecting thesubstrate to the PCB such that electrical signals from the integratedcircuit package are accessible outside the housing by way of the one ormore connectors; and circuitry connected to the one or more connectorsand configured to control the vehicle based on the electrical signalsfrom the integrated circuit package.
 20. The system of claim 19, whereinthe optical device is a camera device, and wherein the integratedcircuit package comprises an image sensor.